Shijo Nagao: search on Z-Library

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1

Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering

Araki, Teppei, Sugahara, Tohru, Jiu, Jinting, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Uchida, Hiroshi, Shinozaki, Kenji, Suganuma, Katsuaki

Journal:

Year:

2013

Language:

english

File:

PDF, 2.26 MB

english, 2013

2

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

Kim, Dongjin, Yamamoto, Yasuyuki, Nagao, Shijo, Wakasugi, Naoki, Chen, Chuantong, Suganuma, Katsuaki

Journal:

Year:

2019

Language:

english

File:

PDF, 5.20 MB

english, 2019

3

Thermostable Ag die-attach structure for high-temperature power devices

Zhang, Hao, Nagao, Shijo, Suganuma, Katsuaki, Albrecht, Hans-Juergen, Wilke, Klaus

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2016

Language:

english

File:

PDF, 4.91 MB

english, 2016

4

Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices

Soichi Sakamoto, Shijo Nagao…

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2013

Language:

english

File:

PDF, 866 KB

english, 2013

5

Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature

Kunimune, Teppei, Kuramoto, Masafumi, Ogawa, Satoru, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Acta Materialia

Year:

2015

Language:

english

File:

PDF, 4.43 MB

english, 2015

6

[IEEE 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO) - Sendai, Japan (2016.8.22-2016.8.25)] 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO) - High thermal stability of SiC packaging with thermosetting imide-based nanocomposite encapsulating materials combined with sintered Ag paste die-attach

Sugioka, Takuo, Nagao, Shijo, Ogawa, Satoshi, Fujibayashi, Teruhisa, Sumida, Yasutaka, Hao, Zhang, Suganuma, Katsuaki

Year:

2016

Language:

english

File:

PDF, 310 KB

english, 2016

7

Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material

Jiu, Jinting, Zhang, Hao, Koga, Shunsuke, Nagao, Shijo, Izumi, Yasuha, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 1.37 MB

english, 2015

8

Pressureless Bonding Using Sputtered Ag Thin Films

Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1.39 MB

english, 2014

9

Die-attaching silver paste based on a novel solvent for high-power semiconductor devices

Jiu, Jinting, Zhang, Hao, Nagao, Shijo, Sugahara, Tohru, Kagami, Noriko, Suzuki, Youji, Akai, Yasuyuki, Suganuma, Katsuaki

Journal:

Journal of Materials Science

Year:

2016

Language:

english

File:

PDF, 1.43 MB

english, 2016

10

Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure

Kim, Dongjin, Chen, Chuantong, Suetake, Aiji, Choe, Chanyang, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.97 MB

english, 2018

11

Silver stress migration bonding driven by thermomechanical stress with various substrates

Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 1016 KB

english, 2015

12

Heel crack propagation mechanism of cold-rolled Cu/Al clad ribbon bonding in harsh environment

Park, Semin, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 5.65 MB

english, 2015

13

Deformation and fracture of nano-sized metal-coated polymer particles: A molecular dynamics study

Wu, Jianyang, Nagao, Shijo, Zhang, Zhiliang, He, Jianying

Journal:

Engineering Fracture Mechanics

Year:

2015

Language:

english

File:

PDF, 2.79 MB

english, 2015

14

Mitigation of Sn Whisker Growth by Small Bi Additions

Jo, Jung-Lae, Nagao, Shijo, Hamasaki, Kyoko, Tsujimoto, Masanobu, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1.69 MB

english, 2014

15

[IEEE 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO) - Rome, Italy (2015.7.27-2015.7.30)] 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO) - Reliability of silver nanowire transparent electrode under atmospheric environment

Jiu, Jinting, Wang, Jun, Sugahara, Tohru, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Suganuma, Katsuaki

Year:

2015

Language:

english

File:

PDF, 675 KB

english, 2015

16

Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design

Chen, Chuantong, Nagao, Shijo, Zhang, Hao, Jiu, Jinting, Sugahara, Tohru, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 3.16 MB

english, 2017

17

Mechanical and Optical Properties Characterization of C-Plane (0001) and M-Plane (10−10) GaN by Nanoindentation and Luminescence

Yokogawa, Toshiya, Fujikane, Masaki, Nagao, Shijo, Nowak, Roman

Journal:

MRS Proceedings

Year:

2015

Language:

english

File:

PDF, 20.20 MB

english, 2015

18

Self-reducible copper ink composed of copper-amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate

Li, Wanli, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Materials Chemistry C

Year:

2016

Language:

english

File:

PDF, 2.81 MB

english, 2016

19

Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices

Zhang, Hao, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 3.03 MB

english, 2017

20

Hillock growth dynamics for Ag stress migration bonding

Oh, Chulmin, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Materials Letters

Year:

2014

Language:

english

File:

PDF, 1.59 MB

english, 2014

21

Carbon Nanotubes: Nanohinge-Induced Plasticity of Helical Carbon Nanotubes (Small 21/2013)

Wu, Jianyang, Nagao, Shijo, He, Jianying, Zhang, Zhiliang

Journal:

Year:

2013

File:

PDF, 1.06 MB

2013

22

One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices

Ding, Su, Jiu, Jinting, Gao, Yue, Tian, Yanhong, Araki, Teppei, Sugahara, Tohru, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Suganuma, Katsuaki, Uchida, Hiroshi

Journal:

ACS Applied Materials & Interfaces

Year:

2016

Language:

english

File:

PDF, 4.42 MB

english, 2016

23

A highly sensitive and flexible pressure sensor with electrodes and elastomeric interlayer containing silver nanowires

Wang, Jun, Jiu, Jinting, Nogi, Masaya, Sugahara, Tohru, Nagao, Shijo, Koga, Hirotaka, He, Peng, Suganuma, Katsuaki

Journal:

Year:

2015

Language:

english

File:

PDF, 1.41 MB

english, 2015

24

Mechanical stabilities of ultrasonic Al ribbon bonding on electroless nickel immersion gold finished Cu substrates

Park, Semin, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Japanese Journal of Applied Physics

Year:

2014

Language:

english

File:

PDF, 1.03 MB

english, 2014

25

Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules

Kim, Dongjin, Chen, Chuantong, Lee, Seung-Joon, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2020

Language:

english

File:

PDF, 3.61 MB

english, 2020

26

Contact Resistance and Metallurgical Connections Between Silver Coated Polymer Particles in Isotropic Conductive Adhesives

Pettersen, Sigurd R., Kristiansen, Helge, Nagao, Shijo, Helland, Susanne, Njagi, John, Suganuma, Katsuaki, Zhang, Zhiliang, He, Jianying

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 1.51 MB

english, 2016

27

High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics

Sungwon Park,, Nagao, Shijo, Kato, Yoshitaka, Ishino, Hiroshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 7.29 MB

english, 2015

28

Reliability analysis of sintered Cu joints for SiC power devices under thermal shock condition

Gao, Yue, Takata, Shuhei, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Bahman, Amir Sajjad, Iannuzzo, Francesco

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.70 MB

english, 2019

29

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Low-Stress Design for SiC Power Modules with Sintered Porous Ag Interconnection

Chen, Chuantong, Nagao, Shijo, Zhang, Hao, Sugahara, Tohru, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

Year:

2016

Language:

english

File:

PDF, 2.13 MB

english, 2016

30

Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition

Park, S. W., Nagao, Shijo, Sugahara, Tohru, Kim, Keun-Soo, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2013

Language:

english

File:

PDF, 1.04 MB

english, 2013

31

Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current

Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, Strogies, Joerg

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 7.58 MB

english, 2014

32

Molecular dynamics study of deformation and fracture in SiC with angular dependent potential model

Kubo, Atsushi, Nagao, Shijo, Umeno, Yoshitaka

Journal:

Computational Materials Science

Year:

2017

Language:

english

File:

PDF, 2.08 MB

english, 2017

33

[IEEE 2016 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2016.3.13-2016.3.14)] 2016 China Semiconductor Technology International Conference (CSTIC) - A novel mechanism of silver microflakes sinter joining

Zhang, Hao, Nagao, Shijo, Lin, Shih-kang, Yokoi, Emi, Chen, Chuantong, Suganuma, Katsuaki

Year:

2016

Language:

english

File:

PDF, 1.97 MB

english, 2016

34

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Diffusional hillock growth in Ag stress migration bonding for power device interconnections

Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

Year:

2015

Language:

english

File:

PDF, 1.48 MB

english, 2015

35

Thermal stress driven Sn whisker growth: in air and in vacuum

Jung-Lae Jo, Shijo Nagao, Tohru Sugahara…

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2013

Language:

english

File:

PDF, 1.23 MB

english, 2013

36

Addition of SiC Particles to Ag Die-Attach Paste to Improve High-Temperature Stability; Grain Growth Kinetics of Sintered Porous Ag

Zhang, Hao, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 2.42 MB

english, 2015

37

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Effect of pre-annealing of Au metallization structure on the bonding performance with low temperature pressureless sintering Ag

Chen, Chuantong, Zhang, Zheng, Nagao, Shijo, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

Year:

2018

Language:

english

File:

PDF, 4.10 MB

english, 2018

38

Electromigration behavior in Cu/Ni–P/Sn–Cu based joint system with low current density

Kadoguchi, Takuya, Gotou, Keisuke, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.43 MB

english, 2015

39

Giant Stretchability and Reversibility of Tightly Wound Helical Carbon Nanotubes

Wu, Jianyang, He, Jianying, Odegard, Gregory M., Nagao, Shijo, Zheng, Quanshui, Zhang, Zhiliang

Journal:

Journal of the American Chemical Society

Year:

2013

Language:

english

File:

PDF, 4.34 MB

english, 2013

40

Strain Rate Controlled Nanoindentation Examination and Incipient Plasticity in Bulk GaN Crystal

Fujikane, Masaki, Yokogawa, Toshiya, Nagao, Shijo, Nowak, Roman

Journal:

Japanese Journal of Applied Physics

Year:

2013

Language:

english

File:

PDF, 768 KB

english, 2013

41

Highly reliable silver nanowire transparent electrode employing selectively patterned barrier shaped by self-masked photolithography

Wang, Jun, Jiu, Jinting, Sugahara, Tohru, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, He, Peng, Suganuma, Katsuaki, Uchida, Hiroshi

Journal:

ACS Applied Materials & Interfaces

Year:

2015

Language:

english

File:

PDF, 1.81 MB

english, 2015

42

Size-dependent Phase Transformation and Fracture of ZnO Nanowires

He, Jianying, Wu, Jianyang, Nagao, Shijo, Qiao, Lijie, Zhang, Zhiliang

Journal:

Year:

2017

Language:

english

File:

PDF, 754 KB

english, 2017

43

Bonding technology based on solid porous Ag for large area chips

Chen, Chuantong, Noh, Seungjun, Zhang, Hao, Choe, Chanyang, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Scripta Materialia

Year:

2018

Language:

english

File:

PDF, 1.96 MB

english, 2018

44

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Investigation on the melting and tensile properties of Bi-containing SAC105 lead-free solder alloys

Chen, Yinbo, Gao, Yuzhou, Liu, Zhi-Quan, Zhang, Hao, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki

Year:

2017

Language:

english

File:

PDF, 902 KB

english, 2017

45

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Thermostable electroless plating optimized for Ag sinter die-attach realizing high TJ device packaging

Zhang, Hao, Nagao, Shijo, Kurosaka, Seigo, Fujita, Hiroshi, Yamamura, Keiji, Shimoyama, Akio, Seki, Shinya, Sugahara, Tohru, Suganuma, Katsuaki

Year:

2016

Language:

english

File:

PDF, 17.17 MB

english, 2016

46

Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air

Zhang, Zheng, Chen, Chuantong, Yang, Yang, Zhang, Hao, Kim, Dongjin, Sugahara, Toru, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Alloys and Compounds

Year:

2019

Language:

english

File:

PDF, 13.50 MB

english, 2019

47

Gas Sensors: Diverse Adsorption/Desorption Abilities Originating from the Nanostructural Morphology of VOC Gas Sensing Devices Based on Molybdenum Trioxide Nanorod Arrays (Adv. Mater. Interfaces 14/2016)

Cong, Shuren, Sugahara, Tohru, Wei, Tingting, Jiu, Jinting, Hirose, Yukiko, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Advanced Materials Interfaces

Year:

2016

File:

PDF, 2.20 MB

2016

48

Thermomechanical properties dependence on chain length in bulk polyethylene: Coarse-grained molecular dynamics simulations

Zhao, Junhua, Nagao, Shijo, Zhang, Zhiliang

Journal:

Journal of Materials Research

Year:

2010

Language:

english

File:

PDF, 2.05 MB

english, 2010

49

Diverse Adsorption/Desorption Abilities Originating from the Nanostructural Morphology of VOC Gas Sensing Devices Based on Molybdenum Trioxide Nanorod Arrays

Cong, Shuren, Sugahara, Tohru, Wei, Tingting, Jiu, Jinting, Hirose, Yukiko, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Advanced Materials Interfaces

Year:

2016

Language:

english

File:

PDF, 1.98 MB

english, 2016

50

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Ag joint bonding technology for bare copper substrate in low temperature, pressureless and air condition

Zhang, Zheng, Chen, Chuantong, Zhang, Hao, Nagao, Shijo, Suganuma, Katsuaki

Year:

2018

Language:

english

File:

PDF, 3.94 MB

english, 2018

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